번인시스템 - LC-2
Low Cost Burn-In Systems for Logic Devices
- Provides burn-in for a variety of device types, including ASICs, FPGAs, video processors, and communication ICs.
- Individual temperature control for each device under test up to 20 W.
- Large system capacity (64 burn-in boards).
- 128 digital I/O channels per burn-in board.
- Per-pin timing, testing, and formatting.
- Accepts burn-in boards up to 12 1/2" by 24".
- 16 pattern zones.
- Up to 250 amps of programmable power to the burn-in board.
번인시스템 - HPB-5C
High-Power Burn-In Systems Up to 150 Watts
- Individual temperature control for each device under test up to 150W.
- Individual pattern zone per burn-in board.
- 24 temperature channels.
- Up to 128 digital I/O channels per burn-in board.
- 32M or 64M vector memory, reconfigurable scan vectors up to 8G.
- Programmable temperature control up to 150° C.
- 16 programmable voltage regulators per burn-in board.
- 1080 amps of DUT power available per burn-in board.
- FPGA architecture for per-pin timing, testing, and formatting of pattern data.
- 8 on-the-fly timing sets.
- System capacity up to 384 devices with active thermal control.
번인시스템 - HPB-4
High-Power Burn-In Up to 600 Watts
- Individual temperature control for each device under test up to 600 W.
- Tests devices at a maximum temperature of 150° C.
- Up to 128 digital I/O channels per burn-in board.
- 16 programmable voltage regulators per burn-in board.
- 1600 amps of DUT power available per burn-in board.
- Liquid-cooled heat sink per device under test.
- Voltage regulator power clamp mode.
- System capacity up to 112 devices.